View M27W80106_732829.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

M27W801
8 Mbit (1Mb x8) low voltage UV EPROM and OTP EPROM
Feature summary

2.7V to 3.6V supply voltage in READ operation Access time: - 80ns at VCC = 3.0V to 3.6V - 100ns at VCC = 2.7V to 3.6V Pin compatible with M27C801 Low power consumption: - 30A max Standby Current - 15mA max Active Current at 5MHz Programming time 50s/Byte High reliability CMOS technology - 2,000V ESD Protection - 200mA Latchup Protection Immunity Electronic signature - Manufacturer Code: 20h - Device Code: 42h ECOPACK(R) packages available
32

1
FDIP32W (F)

32
1
PDIP32 (B)
PLCC32 (K)
TSOP32 (N) 8 x 20 mm
May 2006
Rev 2
1/24
www.st.com 1
Contents
M27W801
Contents
1 2 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Two Line Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 PRESTO IIB programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11
3 4 5 6 7
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/24
M27W801
List of tables
List of tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read mode DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Programming mode DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Margin mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Programming mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FDIP32WC - 32 pin Ceramic Frit-seal DIP, with window (0.260" x 0.420"), package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 PDIP32 - 32 pin Plastic DIP, 600 mils width, package mechanical data . . . . . . . . . . . . . . 19 PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data . . . . . . . . . . . . 20 TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, package mechanical data . . . . 21 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3/24
List of figures
M27W801
List of figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DIP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 PLCC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 TSOP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Programming flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 AC testing input output waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AC testing load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Read mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Margin mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Programming and Verify modes AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package outline . . . . . . . . . . . . . . 18 PDIP32 - 32 pin Plastic DIP, 600 mils width, package outline . . . . . . . . . . . . . . . . . . . . . . 19 PLCC32 - 32 lead Plastic Leaded Chip Carrier, package outline . . . . . . . . . . . . . . . . . . . . 20 TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, package outline . . . . . . . . . . . . 21
4/24
M27W801
Summary description
1
Summary description
The M27W801 is a low voltage 8 Mbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for microprocessor systems requiring large data or program storage and is organized as 1,048,576 by 8 bits. The M27W801 operates in the read mode with a supply voltage as low as 2.7V at -40 to 85C temperature range. The decrease in operating power allows either a reduction of the size of the battery or an increase in the time between battery recharges. The FDIP32W (window ceramic frit-seal package) has a transparent lids which allow the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For applications where the content is programmed only one time and erasure is not required, the M27W801 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages. In order to meet environmental requirements, ST offers the M27W801 in ECOPACK(R) packages. ECOPACK packages are Lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 1. Logic diagram
VCC
20 A0-A19
8 Q0-Q7
E GVPP
M27W801
VSS
AI02363
Table 1.
A0-A19 Q0-Q7 E GVPP VCC VSS
Signal names
Address Inputs Data Outputs Chip Enable Output Enable / Program Supply Supply Voltage Ground
5/24
Summary description Figure 2. DIP connections
A19 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS 1 32 2 31 3 30 4 29 5 28 6 27 7 26 8 25 M27W801 9 24 10 23 11 22 12 21 13 20 14 19 15 18 16 17
AI02671
M27W801
VCC A18 A17 A14 A13 A8 A9 A11 GVPP A10 E Q7 Q6 Q5 Q4 Q3
Figure 3.
PLCC connections
A12 A15 A16 A19 VCC A18 A17 1 32 A7 A6 A5 A4 A3 A2 A1 A0 Q0 A14 A13 A8 A9 A11 GVPP A10 E Q7 9 M27W801 25 17 Q1 Q2 VSS Q3 Q4 Q5 Q6
AI02365
6/24
M27W801 Figure 4. TSOP connections
A11 A9 A8 A13 A14 A17 A18 VCC A19 A16 A15 A12 A7 A6 A5 A4 1 32 GVPP A10 E Q7 Q6 Q5 Q4 Q3 VSS Q2 Q1 Q0 A0 A1 A2 A3
Summary description
8 9
M27W801 (Normal)
25 24
16
17
AI02366
7/24
Device operation
M27W801
2
Device operation
The operating modes of the M27W801 are listed in the Operating Modes table. A single power supply is required in the read mode. All inputs are TTL levels except for GVPP and 12V on A9 for Electronic Signature and Margin Mode Set or Reset.
2.1
Read mode
The M27W801 has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is available at the output after a delay of tGLQV from the falling edge of G, assuming that E has been low and the addresses have been stable for at least tAVQV-tGLQV.
2.2
Standby mode
The M27W801 has a standby mode which reduces the supply current from 15mA to 20A with low voltage operation VCC 3.6V, see Read Mode DC Characteristics table for details. The M27W801 is placed in the standby mode by applying a CMOS high signal to the E input. When in the standby mode, the outputs are in a high impedance state, independent of the GVPP input.
2.3
Two Line Output Control
Because EPROMs are usually used in larger memory arrays, the product features a 2 line control function which accommodates the use of multiple memory connection. The two line control function allows:

the lowest possible memory power dissipation complete assurance that output bus contention will not occur
For the most efficient use of these two control lines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device.
8/24
M27W801
Device operation
2.4
System considerations
The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the devices. The supply current, ICC, has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of the transient current peaks is dependent on the capacitive and inductive loading of the device at the output. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1F ceramic capacitor be used on every device between VCC and VSS. This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7F bulk electrolytic capacitor should be used between VCC and VSS for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces.
2.5
Programming
The M27W801 has been designed to be fully compatible with the M27C801 and has the same electronic signature. As a result the M27W801 can be programmed as the M27C801 on the same programming equipment applying 12.75V on VPP and 6.25V on VCC by the use of the same PRESTO IIB algorithm. When delivered (and after each `1's erasure for UV EPROM), all bits of the M27W801 are in the "1" state. Data is introduced by selectively programming "0"s into the desired bit locations.Although only '0' will be programmed, both "1" and "0" can be present in the data word. The only way to change a `0' to a `1' is by die exposure to ultraviolet light (UV EPROM). The M27W801 is in the programming mode when VPP input is at 12.75V and E is pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6.25V 0.25V.
2.6
PRESTO IIB programming algorithm
PRESTO IIB Programming Algorithm allows the whole array to be programmed with a guaranteed margin, in a typical time of 52.5 seconds. This can be achieved with STMicroelectronics M27W801 due to several design innovations to improve programming efficiency and to provide adequate margin for reliability. Before starting the programming the internal MARGIN MODE circuit must be set in order to guarantee that each cell is programmed with enough margin. Then a sequence of 50s program pulses are applied to each byte until a correct verify occurs (see Figure 5). No overprogram pulses are applied since the verify in MARGIN MODE at VCC much higher than 3.6V, provides the necessary margin.
9/24
Device operation Figure 5. Programming flowchart
VCC = 6.25V, VPP = 12.75V SET MARGIN MODE
M27W801
n=0
E = 50s Pulse NO ++n = 25 YES NO VERIFY YES Last Addr NO ++ Addr
FAIL
YES RESET MARGIN MODE CHECK ALL BYTES 1st: VCC = 5V 2nd: VCC = 2.7V
AI01271C
2.7
Program Inhibit
Programming of multiple M27W801s in parallel with different data is also easily accomplished. Except for E, all like inputs including GVPP of the parallel M27W801 may be common. A TTL low level pulse applied to a M27W801's E input, with VPP at 12.75V, will program that M27W801. A high level E input inhibits the other M27W801s from being programmed.
2.8
Program Verify
A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with G at VIL. Data should be verified with tELQV after the falling edge of E.
10/24
M27W801
Device operation
2.9
Electronic signature
The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25C 5C ambient temperature range that is required when programming the M27W801. To activate the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of the M27W801. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during Electronic Signature mode. Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics M27W801, these two identifier bytes are given in Table 3 and can be read-out on outputs Q7 to Q0. Note that the M27W801 and M27C801 have the same identifier byte.
2.10
Erasure operation (applies to UV EPROM)
The erasure characteristics of the M27W801 is such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 A. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 A range. Research shows that constant exposure to room level fluorescent lighting could erase a typical M27W801 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27W801 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27W801 window to prevent unintentional erasure. The recommended erasure procedure for the M27W801 is exposure to short wave ultraviolet light which has wavelength 2537 A. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 30 W-sec/cm2. The erasure time with this dosage is approximately 30 to 40 minutes using an ultraviolet lamp with 12000 W/cm2 power rating. The M27W801 should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure. Table 2. Operating modes(1)
Mode Read Output Disable Program Program Inhibit Standby Electronic Signature
1. X = VIH or VIL, VID = 12V 0.5V.
E VIL VIL VIL Pulse VIH VIH VIL
GVPP VIL VIH VPP VPP X VIL
A9 X X X X X VID
Q7-Q0 Data Out Hi-Z Data In Hi-Z Hi-Z Codes
11/24
Maximum rating Table 3. Electronic signature
A0 VIL VIH Q7 0 0 Q6 0 1 Q5 1 0 Q4 0 0 Q3 0 0 Q2 0 0 Q1 0 1 Q0 0 0
M27W801
Identifier Manufacturer's Code Device Code
Hex Data 20h 42h
3
Maximum rating
Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 4.
Symbol TA TBIAS TSTG VIO(2) VCC VA9(2) VPP Ambient Operating
Absolute maximum ratings
Parameter Temperature(1) Value -40 to 125 -50 to 125 -65 to 150 -2 to 7 -2 to 7 -2 to 13.5 -2 to 14 Unit C C C V V V V
Temperature Under Bias Storage Temperature Input or Output Voltage (except A9) Supply Voltage A9 Voltage Program Supply Voltage
1. Depends on range. 2. Minimum DC voltage on Input or Output is -0.5V with possible undershoot to -2.0V for a period less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns.
12/24
M27W801
DC and AC parameters
4
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 5. AC measurement conditions
High Speed Input Rise and Fall Times Input Pulse Voltages Input and Output Timing Ref. Voltages 10ns 0 to 3V 1.5V Standard 20ns (10% to 90%) 0.4V to 2.4V 0.8V and 2V
Figure 6.
AC testing input output waveform
High Speed 3V 1.5V 0V
Standard 2.4V 2.0V 0.8V
AI01822
0.4V
Figure 7.
AC testing load circuit
1.3V
1N914
3.3k DEVICE UNDER TEST CL
OUT
CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance
AI01823B
13/24
DC and AC parameters Table 6.
Symbol CIN COUT
M27W801 Capacitance(1) (2)
Parameter Input Capacitance Output Capacitance Test Condition VIN = 0V VOUT = 0V Min Max 6 12 Unit pF pF
1. TA = 25 C, f = 1 MHz 2. Sampled only, not 100% tested.
Table 7.
Symbol ILI ILO ICC ICC1 ICC2 IPP VIL VIH(3) VOL VOH
Read mode DC characteristics(1) (2)
Parameter Input Leakage Current Output Leakage Current Supply Current Supply Current (Standby) TTL Supply Current (Standby) CMOS Program Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage TTL IOL = 2.1mA IOH = -1mA 2.4 Test Condition 0V VIN VCC 0V VOUT VCC E = VIL, GVPP = VIL, IOUT = 0mA, f = 5MHz, VCC 3.6V E = VIH E > VCC - 0.2V, VCC 3.6V VPP = VCC -0.6 Min Max 10 10 15 1 30 10 0.2 VCC Unit A A mA mA A A V V V V
0.7 VCC VCC + 0.5 0.4
1. TA = -40 to 85 C; VCC = 2.7V to 3.6V; VPP = VCC 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Maximum DC voltage on Output is VCC +0.5V.
Table 8.
Symbol ILI ICC IPP VIL VIH VOL VOH VID
Programming mode DC characteristics(1) (2)
Parameter Input Leakage Current Supply Current Program Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage TTL A9 Voltage IOL = 2.1mA IOH = -1mA 3.6 11.5 12.5 E = VIL -0.3 2 Test Condition VIL VIN VIH Min Max 10 50 50 0.8 VCC + 0.5 0.4 Unit A mA mA V V V V V
1. TA = 25 C; VCC = 6.25V 0.25V; VPP = 12.75V 0.25V 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
14/24
M27W801 Figure 8.
A0-A19
DC and AC parameters Read mode AC waveforms
VALID tAVQV E tGLQV G tELQV Q0-Q7 tGHQZ Hi-Z tEHQZ tAXQX VALID
AI01583B
Table 9.
Read mode AC characteristics(1) (2)
M27W801 -100 (3) -120 (-150/-200) Test Unit Condition VCC = 3.0V VCC = 2.7V VCC = 2.7V to to 3.6V to 3.6V 3.6V Min Max 80 80 50 0 0 0 50 50 0 0 0 Min Max 100 100 60 60 60 0 0 0 Min Max 120 120 70 70 70 ns ns ns ns ns ns
Symbol
Alt
Parameter
tAVQV tELQV tGLQV tEHQZ(4) tGHQZ
(4)
tACC tCE tOE tDF tDF tOH
Address Valid to Output Valid Chip Enable Low to Output Valid Output Enable Low to Output Valid Chip Enable High to Output Hi-Z Output Enable High to Output Hi-Z Address Transition to Output Transition
E = VIL, G = VIL G = VIL E = VIL G = VIL E = VIL E = VIL, G = VIL
tAXQX
1. TA = -40 to 85 C; VCC = 2.7V to 3.6V; VPP = VCC 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Speed obtained with High Speed AC measurement conditions. 4. Sampled only, not 100% tested.
15/24
DC and AC parameters Figure 9.
VCC
M27W801 Margin mode AC waveforms
A8
A9 tA9HVPH GVPP tVPHEL E tA10HEH A10 Set tEXA10X tEXVPX tVPXA9X
A10 Reset tA10LEH
AI00736B
1. A8 High level = 5V; A9 High level = 12V.
Table 10.
Symbol tA9HVPH tVPHEL tA10HEH tA10LEH tEXA10X tEXVPX tVPXA9X
Margin mode AC characteristics(1) (2)
Alt tAS9 tVPS tAS10 tAS10 tAH10 tVPH tAH9 Parameter VA9 High to VPP High VPP High to Chip Enable Low VA10 High to Chip Enable High (Set) VA10 Low to Chip Enable High (Reset) Chip Enable Transition to VA10 Transition Chip Enable Transition to VPP Transition VPP Transition to VA9 Transition Test Condition Min 2 2 1 1 1 2 2 Max Unit s s s s s s s
1. TA = 25 C; VCC = 6.25V 0.25V; VPP = 12.75V 0.25V 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
16/24
M27W801 Figure 10. Programming and Verify modes AC waveforms
A0-A19 tAVEL Q0-Q7 tQVEL VCC tVCHEL GVPP tVPHEL E tELEH tVPLEL tEHVPX DATA IN tEHQX VALID
DC and AC parameters
tEHAX DATA OUT tEHQZ
tELQV
PROGRAM
VERIFY
AI01270
Table 11.
Symbol tAVEL tQVEL tVCHEL tVPHEL tVPLVPH tELEH tEHQX tEHVPX tVPLEL tELQV tEHQZ(3) tEHAX
Programming mode AC characteristics(1) (2)
Alt tAS tDS tVCS tOES tPRT tPW tDH tOEH tVR tDV tDFP tAH Parameter Address Valid to Chip Enable Low Input Valid to Chip Enable Low VCC High to Chip Enable Low VPP High to Chip Enable Low VPP Rise Time Chip Enable Program Pulse Width (Initial) Chip Enable High to Input Transition Chip Enable High to VPP Transition VPP Low to Chip Enable Low Chip Enable Low to Output Valid Chip Enable High to Output Hi-Z Chip Enable High to Address Transition 0 0 Test Condition Min 2 2 2 2 50 45 2 2 2 1 130 55 Max Unit s s s s ns s s s s s ns ns
1. TA = 25 C; VCC = 6.25V 0.25V; VPP = 12.75V 0.25V 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Sampled only, not 100% tested.
17/24
Package mechanical
M27W801
5
Package mechanical
Figure 11. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package outline
A2 A3 A1 B1 B D2 D S
N
A L eA eB C
e1
K
1
E1
E
K1
FDIPW-b
1. Drawing is not to scale.
Table 12.
FDIP32WC - 32 pin Ceramic Frit-seal DIP, with window (0.260" x 0.420"), package mechanical data
millimeters inches Max 5.72 0.51 3.91 3.89 0.41 1.45 - 0.23 41.73 38.10 2.54 14.99 - - - 16.18 15.24 - 13.06 6.60 10.67 - - 3.18 1.52 4 32 1.40 4.57 4.50 0.56 - 0.30 42.04 - - - 18.03 - 13.36 - - 4.10 2.49 11 0.260 0.420 0.600 1.500 0.100 0.590 0.057 0.020 0.154 0.153 0.016 - 0.009 1.643 - - - 0.637 - 0.514 - - 0.125 0.060 4 32 Typ Min Max 0.225 0.055 0.180 0.177 0.022 - 0.012 1.655 - - - 0.710 - 0.526 - - 0.161 0.098 11
Symbol Typ A A1 A2 A3 B B1 C D D2 e eA eB E E1 K K1 L S N Min
18/24
M27W801
Package mechanical Figure 12. PDIP32 - 32 pin Plastic DIP, 600 mils width, package outline
A2 A1 b1 b D2 D S
N
A L eA c
e
E1
1
E
PDIP-C
1. Drawing is not to scale.
Table 13.
Symbol
PDIP32 - 32 pin Plastic DIP, 600 mils width, package mechanical data
millimeters Typ Min Max 4.83 0.38 3.81 0.41 1.14 0.23 41.78 38.10 15.24 2.54 - - - 15.24 13.46 1.65 3.05 0 32 0.53 1.65 0.38 42.29 - - - 15.88 13.97 2.21 3.56 15 1.500 0.600 0.100 0.150 0.016 0.045 0.009 1.645 - - - 0.600 0.530 0.065 0.120 0 32 0.021 0.065 0.015 1.665 - - - 0.625 0.550 0.087 0.140 15 0.015 Typ inches Min Max 0.190
A A1 A2 b b1 c D D2 eA e E E1 S L N
19/24
Package mechanical Figure 13. PLCC32 - 32 lead Plastic Leaded Chip Carrier, package outline
D D1
1N
M27W801
A1 A2
B1 E2 E3 E1 E e F 0.51 (.020) 1.14 (.045) D3 R CP A E2 B
D2
D2
PLCC-A
1. Drawing is not to scale.
Table 14.
Symbol
PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data
millimeters Typ Min 3.17 1.53 0.38 0.33 0.66 Max 3.56 2.41 - 0.53 0.81 0.10 12.32 11.35 4.78 7.62 - 14.86 13.89 6.05 10.16 1.27 - - 0.00 0.89 - 32 12.57 11.51 5.66 - 15.11 14.05 6.93 - - 0.13 - 0.035 0.400 0.050 0.300 0.485 0.447 0.188 - 0.585 0.547 0.238 - - 0.000 - 32 Typ inches Min 0.125 0.060 0.015 0.013 0.026 Max 0.140 0.095 - 0.021 0.032 0.004 0.495 0.453 0.223 - 0.595 0.553 0.273 - - 0.005 -
A A1 A2 B B1 CP D D1 D2 D3 E E1 E2 E3 e F R N
20/24
M27W801
Package mechanical Figure 14. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, package outline
A2
1 N
e E B
N/2
D1 D
A CP
DIE
C
TSOP-a
A1
L
1. Drawing is not to scale.
Table 15.
TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, package mechanical data
millimeters inches Max 1.200 0.050 0.950 0.170 0.100 0.150 1.050 0.250 0.210 0.100 19.800 18.300 0.500 - 7.900 0.500 32 0 5 20.200 18.500 - 8.100 0.700 0.0197 0.7795 0.7205 - 0.3110 0.0197 32 0 5 0.0020 0.0374 0.0067 0.0039 Typ Min Max 0.0472 0.0059 0.0413 0.0098 0.0083 0.0039 0.7953 0.7283 - 0.3189 0.0276
Symbol Typ A A1 A2 B C CP D D1 e E L N Min
21/24
Part numbering
M27W801
6
Part numbering
Table 16.
Example: Device Type M27 Supply Voltage W = 2.7V to 3.6V Device Function 801 = 8 Mbit (1Mb x8) Speed -100 (1),(2) = 100 ns -120 = 120 ns Not For New Design(3) -150 = 150 ns -200 = 200 ns Package F = FDIP32W(4) B = PDIP32 K = PLCC32 N = TSOP32: 8 x 20 mm(4) Temperature Range 6 = -40 to 85 C Options TR = Tape & Reel Packing
1. High Speed, see AC Characteristics section for further information. 2. This speed also guarantees 80ns access time at VCC = 3.0V to 3.6V. 3. These speeds are replaced by the 120ns. 4. Packages option available on request. Please contact STMicroelectronics local Sales Office.
Ordering information scheme
M27W801 -100 K 6 TR
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
22/24
M27W801
Revision history
7
Revision history
Table 17.
Date July 1999
Document revision history
Version 1.0 First Issue FDIP32W Package Dimension, L Max added (Table 12.) TSOP32 Package Dimension changed (Table 15) 0 to 70C Temperature Range removed Programming Time changed Read Mode AC Characteristics: tAVQV, tELQV, tGLQV, tEHQZ, tGHQZ changed (Table 9) PDIP32 Mechanical data and drawing changed (Table 13) PLCC32 Mechanical data: A2 clarified (Table 14) Read Mode DC Characteristics: VOH clarified (Table 7) PLCC32 Mechanical data and drawing clarified (Table 14, Figure 13) ICC Standby value clarified Ordering Information Scheme clarified (Table 16) TSOP32 Package Mechanical Data clarified (Table 15) Document converted to new template (sections added, information moved). Packages are ECOPACK(R) compliant. Package specifications updated (see Section 5: Package mechanical). Revision Details
15-Mar-2000
1.1
21-Apr-2000
1.2
20-Feb-2002
1.3
06-May-2002 21-Mar-2003
1.4 1.5
22-May-2006
2
23/24
M27W801
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
(c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
24/24

▲Up To Search▲

Price & Availability of M27W80106

	To Download M27W80106 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .